Products & Services
- Miniaturisation – System in package
- Semiconductor Packaging
- Test and Qualification
- IC Design
- Franchised Silicon Distribution
- Wafer Probe
- Bare Die Testing
- Attrition Management
- BGA Re-Work and Re-balling
- Trim and Form components
- Pb Terminal Conversion
- CEM Assembly
- Compliant Lead Attach
- Epoxy Preforming
- High Quality Connector Manufacture
- Sub Miniature and Micro Connectors
- Ruggedised Systems
- Rugardised PC’s, Workstations
- Sealed Technology
- Off Shore Assembly
- Box Build Assembly
